Boost product reliability and accelerate testing with the LIB Thermal Cycling Test Chamber. Designed to simulate extreme temperature fluctuations—from -70? to +150?—with precise ±0.5? control and rapid heating/cooling rates up to 15?/min, it exposes products to real-world thermal stresses in a fraction of the time. Suitable for ESS components, electronics, and small to medium products, it supports alternating temperature, accelerated wet heat, and constant temperature tests.
By revealing potential performance decline, physical damage, or functional failure early, this chamber helps manufacturers enhance durability, optimize designs, and deliver products that withstand the toughest thermal environments.
link:https://www.libclimatechambers.com/thermal-stress-chamber/thermal-cycling-test-chamber.html